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Easy to operate, simply load the wafer and close the lid.
Automatic calculation and display of sheet or slice resistivity, V/I, metallization thickness, and P-N type. Ideal for epitaxial, diffused, ion implanted and metallized layers. Up to 6" dia. wafer capability. Remote head available as an option.
FPP 5000 OPERATING INSTRUCTIONS
Comments:
The FPP 5000 is extremely easy to use. The simplified instructions are: select the program you want, put the wafer on the platen, put a wafe support fixture, and close the lid. The measurement runs automatically when you close the lid.
Procedure
1. Select the program that you want to run by pressing the appropriate button on the lower right hand of the tester. If you want to measure the resistivity press SLICE, and also press the TYPE button. This will determine the wafer type when the measurement is done. If you want to measure the sheet resistance, press SHEET button.
2. For Slice and Sheet, you must enter the thickness of the wafer (slice) or doped layer (Sheet). Enter the thickness used by the FPP5000 program. Press the PRGM button. Lets use Slice as the example. The display will now show the wafer thickness. If the display does not show 0.620E3, then you must enter your wafer thickness of 620 m. Enter 620 to get 0.620 on the display, then press 3 to enter the exponent. Press Store to store your wafer thickness in the program. Press PRGM again to return to the measurement mode.
3. Lift the lid and place your wafer face down on the platen.
4. Select the appropriate wafer fixxture (used the biggest one even though its too big) from the black box near the FPP5000 and place it on the wafer.
5. Move the wafer so that the probes will measure the desired area.
6. Close, press, and hold the lid. The measurement takes place automatically and the results displayed.
7. When .finished, remove the wafer .fixture and place it in the black box. Remove your wafer and close
the lid.
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